Triple Target Desk Sputter Coater

DST3 High Vacuum, Triple Target, Magnetron Desk Sputter Coater

 


 

Desk Sputter Coater DST3

DST3 High Vacuum, Triple Target, Magnetron Desk Sputter Coater 

The Desk Sputter Coater DST3 is a desktop, triple target, turbo molecular-pumped vacuum sputter coater, suitable for magnetron sputtering of the semiconductors, dielectrics and (oxidizing & noble) metals. The system also can be fitted by an evaporation source for thermal evaporation process. The sputtering machine model DST3 is equipped with a large chamber and triple water - cooled cathodes which make it suitable for both sputtering a single large diameter specimen and co-sputtering a small diameter specimen. Magnetron sputtering process caused Desk Sputter Coater DST3 produces dens thin films with very good adhesion. 



According to the state of the cathodes, DST3 is available in two models:

DST3 – A (Angled Cathodes):

 

The DST3-A is equipped with three angled cathodes with a common focal point. It can sputter from two or three targets simultaneously or independently to form alloys or multilayer deposition respectively.

DST3-Angled_Cathodes DST3-Angled_Cathodes_internal



DST3 – S (Straight Cathodes):

dst3 a - rack
 
  • The Sputter Coater DST3-S with three straight cathodes is suitable for sputtering deposition from a single large specimen with diameter up to 20 Cm or several small specimens. 

  • Non-conducting materials such as semiconductors and dielectrics couldn’t be sputter by DC sputtering process. To overcome this limitation of DC sputtering, the RF sputtering (radio frequency sputtering) should be replaced. The alternating current in RF Sputtering process prevents charge accumulation in the surface of the Non-conducting targets through the discharging them each half cycle.

  • The Desk Sputter Coater DST3 is capable to do RF Sputtering and DC Sputtering.  This Sputtering machine can sputter semiconductors, dielectrics, and metal (oxidizing & noble) targets.

  • The system is equipped with an easy-adjustable matching box, minimizing the reflected power in the RF sputtering.

  • For increasing film adhesion to the substrate and to improve the film structures, .a 300 V DC bias voltage can be applied to the substrate during the sputtering deposition.


Features

 

  • High vacuum turbo pump 300 l/s
  • Diaphragm backing pump
  • Full range vacuum gauge
  • Three 2” water - cooled sputtering cathodes
  • Large chamber suitable for large specimen sputtering depositions
  • Target selection for multilayer thin films
  • Co-sputtering to form alloy films
  • Two Quartz crystal monitoring system for real-time thickness measurement (1 nm precision)
  • Manual or automatic Timed and Thickness deposition
  • Intuitive touch screen to control the coating process and rapid data input
  • User-friendly software that can be updated via the network
  • Equipped with the electronic shutter
  • Equipped with a rotary sample holder with the ability to tilt in direction of cathodes
  • 500 °C substrate heater
  • 300 V DC substrate bias voltages
  • Unlimited sputtering time without breaking the vacuum
  • two-year warranty

 

Ion sputtering in the clean vacuum environment

The vacuum chamber of the sputtering system is cylindrical Pyrex with 300 mm OD and 200 mm H.   The sputter coater is fitted with an internally mounted 300 L/s turbomolecular pump, backed by a diaphragm pump. It introduces a clean vacuum without oil contamination which normally exists with an ordinary diffusion pump.

 

Touch screen control with colorful display

 

The Desk Sputter Coater DST3 is equipped with a 7'' colored touch screen, fully automatic control and data input that can be operated by even inexperienced users. The vacuum, current and deposition information can be observed as digital data or curves on the touch screen panel. Information of the last 300 sputtering deposition process can also be saved in the history page.

desk sputter coater Touch screen control with colorful display touch screen software-dst3-a

 

 

Applications of the DST3, reactive sputtering system

 

The sputtering machine DST3 is a versatile ion sputtering system able to do DC sputtering and RF sputtering with the high sputtering yield at lower gas pressure through the magnetron sputtering process.

This sputtering equipment could be used for many thin film applications such as:

 

 

  • Metal, Semiconductor and Dielectric Films deposition
  • Nano & Microelectronic technology
  • Solar cell applications
  • Co-Sputtering processes
  • Glad sputtering
  • Optical components coating
  • Thin film sensors
  • Magnetic thin film devices
  • Computer memory applications
  • Fine-grain structural deposition for SEM  &  FE-SEM sample preparation

Triple Target Desk Sputter Coater

 

Specification of the DST3, magnetron sputtering system

  • Ultimate Vacuum: Less than 2x10-6 torr

  • Independent sputtering control rate for each cathode to produce fine grain structures

  • Automatic control of sputtering power independent of pressure

  • Automatic control of the cathode's temperatures to protect the lifetime of the magnets

  • Data is rapidly registered by using fully automatic touch screen control

  • Precision Mass Flow meter (MFC) to fine control of vacuum and pressure in reactive sputtering

  • Records and plots coating parameters graphs.

  • Transfers curves and deposition process data by a USB port to PC

  • 0-1000 mA DC power supply

  • Utilities: 220V- 50HZ- 16A

  • Box Dimensions: 50 Cm H x 60 Cm W x 47 Cm D

  • Shipping Weight:100kg  (pump, rack, and box)

 

Ion sputtering system options and Accessories

 

The DST3 has the flowing options and accessories:

  • Thermal evaporation insert
  • High current power supply
  • Quartz crystal
  • Spare glass
  • Sputtering targets
  • Thermal source materials